USI has presented its Silicon Carbide (SiC) chip-embedded packaging technology. The company showcased this development, which integrates SiC chips within the packaging structure.
This technology aims to offer enhanced power solutions. The specifics of the performance improvements and the exact applications were detailed at the PCIM Europe 2026 event.
Further details regarding the technical specifications and market impact of this new packaging approach are expected as USI expands its offerings.
