Yao Hua Investor Conference: Bullish on AI and Low-Orbit Satellite Momentum, Raising Prices 5-20% in Response to Costs
2026-06-26 15:05
Economic Daily News / Reporter Yin Huizhong / Taipei Real-time Report
PCB manufacturer Yao Hua (2367) continues its transformation to develop high-end products. On the 26th, it held an investor conference to release its latest outlook, expressing optimism that AI and low-orbit satellites will drive five major revenue and profit growth drivers. Yao Hua also reported that in the first half of this year, automotive applications are estimated to account for 35% of revenue, low-orbit satellites 20%. Regarding raw material shortages disrupting consumer shipments, Yao Hua explained that first-quarter capacity utilization was low, below 80%. Due to raw material price increases and shortages, the first-quarter gross margin was affected. The company has responded by raising prices with customers, expecting a more pronounced effect of 5-20% in the second and third quarters. Combined with capacity expansions at the Thailand and Nantong plants, and new AI server customer applications, results will be reflected in the second half of the year.
Yao Hua explained that, first, the low-orbit satellite application has entered stable mass production, currently accounting for about 15-20% of total revenue, mainly used in ground receiving equipment. As satellite communication demand continues to grow, it is also gradually entering satellite body-related applications, currently in the sample development stage.
Second, Thailand Factory: Yao Hua said the Thailand plant has officially started mass production in the second quarter, currently focusing on LEO-related products. In the future, in addition to supporting regional supply chain needs for international customers, it will also serve as an important production base for the company's global market expansion.
Third, AI Infrastructure: Yao Hua mentioned it is continuously laying out AI server-related applications, currently focusing on Optical Module high-speed and AI server board development, and entering the AI infrastructure supply chain through HLC and HDI products.
Fourth, HLC & HDI Upgrade: Yao Hua noted that as AI applications gradually extend from Training AI to Inference AI and Physical AI, it drives the development of emerging applications such as smart terminals, robots, and automation equipment, boosting demand for high-density interconnection and high-reliability PCBs. It will continue to deepen HLC and HDI product layouts to seize the next wave of AI application growth opportunities.
Fifth, Automotive & Consumer Applications: Yao Hua mentioned it will continue to deepen its presence in the automotive and consumer product markets. Although short-term terminal demand and industry adjustments are affecting the market, the recovery speed still needs observation, but related products remain an important foundation for stable operations.
