The editor today (28th) selected 5 important domestic and international financial news items. Yageo* Chairman Chen Taiming said on the 27th that the ten-year transformation is gaining momentum, and the book-to-bill ratio (B/B Ratio) has surpassed Murata. Yageo will advance on three fronts—raising utilization rates, building inventory, and removing capacity bottlenecks—to meet the AI infrastructure order wave. With Murata and Samsung Electro-Mechanics both raising prices for high-end MLCCs, will Yageo follow suit? Chen Taiming responded generously: stay tuned!
[1] Busy Second Half: Chen Taiming Says Stay Tuned for Price Hikes
Chen Taiming said at Yageo's annual shareholders' meeting on the 27th that AI has become a rigid demand, and the main battlefield for high-end passive component technology competition has shifted from small-size, high-capacitance in the smartphone era to high reliability, high temperature resistance, high current, and high voltage required by AI. Miniaturization is no longer the main consideration, and AI is an extension of automotive applications. Kemet's tantalum capacitors and MLCCs have been trained in the automotive field for years, seamlessly transitioning into AI. "The gap between Yageo and Murata is no longer large!"
[2] Morgan Stanley Praises TSMC, Pushes 30x P/E Ratio
On the eve of COMPUTEX, Morgan Stanley held its first "Morgan Stanley Asia AI Summit" in Taipei on the 28th and 29th, with over 610 global investors and 85 AI industry chain companies participating. The event fully focused on Taiwan's high-tech industry's strategic core role in the key AI chain, becoming an important bellwether for international investors to position themselves.
[3] UMC's US 12nm Plant to Mass Produce in 2027; Advanced Packaging and Silicon Photonics Advance Simultaneously
UMC held its shareholders' meeting on the 27th. Besides approving a cash dividend of NT$2.6 per share, market attention focused on AI, advanced packaging, and global capacity expansion. UMC Co-General Manager Wang Shih stated that driven by AI, high-performance computing (HPC), and high-speed transmission demand, the semiconductor industry is entering a new upgrade cycle. UMC is not only deepening its mature and special process advantages but also advancing its US-based 12nm FinFET platform, advanced packaging, and silicon photonics technology deployment.
[4] China CCL Manufacturer Jianchao Raises Prices for Third Consecutive Month
China's CCL (copper-clad laminate) leader Jianchao has again initiated price increases. The company announced on the 27th that due to high copper prices, rising glass cloth prices, and increasingly tight supply, it will raise product prices effective immediately: board materials (all thicknesses) by 10%, and PP (prepreg) by as much as 20%.
[5] Memory Becomes Core Strategic Resource; Micron and SK Hynix Market Caps Reach Trillion Dollars
The AI boom has fully ignited demand for high-bandwidth memory (HBM) and high-performance computing (HPC), driving memory chipmaker stock prices to surge. After Samsung Electronics broke the $1 trillion market cap milestone in early May, Micron and SK Hynix have also joined the trillion-dollar club. The three memory giants are now all in the "trillion-dollar club," showing that under the AI infrastructure wave, memory has become one of the most core strategic resources in the semiconductor industry.
